Market Executive Summary

OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services.The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.

Market Analysis and Insights: Global Outsourced Semiconductor Assembly and Testing Market

The global Outsourced Semiconductor Assembly and Testing market is projected to grow from US$ 38880 million in 2024 to US$ 56090 million by 2030, at a Compound Annual Growth Rate (CAGR) of 6.3% during the forecast period.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Covers:

This report presents an overview of global market for Outsourced Semiconductor Assembly and Testing market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030. 

This report researches the key producers of Outsourced Semiconductor Assembly and Testing, also provides the revenue of main regions and countries.  of the upcoming market potential for Outsourced Semiconductor Assembly and Testing, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Outsourced Semiconductor Assembly and Testing revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Outsourced Semiconductor Assembly and Testing market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Outsourced Semiconductor Assembly and Testing revenue, projected growth trends, production technology, application and end-user industry.

Market Segmentation

Global Outsourced Semiconductor Assembly and Testing Companies Covered

ASE Technology Holding, Amkor Technology, Jiangsu Changjiang Electronics Technology, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD., TongFu Microelectronics Co., LTD., King Yuan Electronics Co., Ltd., STATS ChipPAC, Siliconware Precision Industries, Unisem Group, UTAC Group, Chipbond Technology Corporation, ChipMOS Technologies

Global Outsourced Semiconductor Assembly and Testing Market, by Region

North America (U.S., Canada, Mexico)

Europe (Germany, France, UK, Italy, etc.)

Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)

South America (Brazil, etc.)

Middle East and Africa (Turkey, GCC Countries, Africa, etc.)

Global Outsourced Semiconductor Assembly and Testing Market, Segment by Type

Outsourced Semiconductor Testing

Outsourced Semiconductor Assembly

Global Outsourced Semiconductor Assembly and Testing Market, Segment by Application

Automotive

Consumer Electronics

Industrial

Telecommunication

Others

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Revenue of Outsourced Semiconductor Assembly and Testing in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.

Chapter 3: Detailed analysis of Outsourced Semiconductor Assembly and Testing companies’ competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.

Chapter 7: Europe by Type, by Application and by country, revenue for each segment.

Chapter 8: China by Type, and by Application, revenue for each segment.

Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.

Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.

Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Outsourced Semiconductor Assembly and Testing revenue, gross margin, and recent development, etc.

Chapter 12: Analyst's Viewpoints/Conclusions